The fine step of the lead bonding package begins with the cutting. After the precision wafer is thinned, the automated tool accurately slices it to ensure smooth and silky edges. The chip is then carefully bonded to the matching size pad, with the use of soft solder or polymer to enhance the stability of the connection. Bonded with gold wireArt wire bonding technology is the key link, and hot pressure welding and thermoultrasonic welding technology are used, which requires high linear precision and just right bonding arc.
Core process Lead bonding: Gold wire with a diameter of 0.025-0.032mm is traditionally used, and the bonding process includes thermocompression welding and thermoultrasonic welding. The gold wire is bonded at 100-400 ° C, and the study tries to replace it with aluminum or copper to reduce the temperature and improve the life of the device. Plasma cleaning ensures film adhesion in key steps, such as enhancing Au film adhesion on Si substrates.
FilpChip-BGA streamThe process includes: wafer thinning → wafer bump generation → wafer cutting → chip flip → reflow soldering → bare chip underfill → Surface marking →BGA substrate planting → substrate reflow soldering → cutting separation → Final inspection → test packaging. Before FilpChip-BGA packaging, wafers are also thinned and Bump points are created on the wafers. After that, the wafer is cut and the chip is flip welded to the substrate.
The SIP package process is divided into two types according to the connection between the chip and the substrate: lead bonding package and reverse mounting welding. The lead bonding packaging process includes: wafer thinning, wafer cutting,Chip bonding, lead bonding, plasma cleaning, liquid sealant potting, solder ball assembly, reflow soldering, surface marking, separation, final inspection, testing and packaging. Wafer thinning refers to the grinding of the wafer by mechanical or chemical-mechanical means to a thickness suitable for packaging.
Job Responsibilities of UI Designer 1 Responsibility Responsible for the design and creative work of website and mobile terminal software products; Set the overall visual style of the product (including interface, icon style and uniform specifications, etc.) and UI design;Participate in the formulation and specification of design experience and process; Responsible for the inspection of visual realization, supervise the quality of product visual realization; Pay attention to user feedback and communication, and continuously optimize product UI based on analysis results.
The designer focuses on the customer and always understands the customer's requirements. Designers do a good job of communication and service with customers. The design scheme meets the function and practical value of decoration engineering as far as possible. The design scheme is reasonable and the material selection is appropriate. The design text is clear and clear, and should not be sloppy. Field measurements are accurate. The designer should make sure that the drawings have joint review and the construction site has design disclosure.
Field research and corporate strategy. The establishment of clear quality standards helps all employees to form a consensus on quality and provides a basis for subsequent quality management activities.
The first step in the quality management process is to establish clear product or service quality and standards. This needs to be set according to market needs, customer needs and industry best practices. Clear standards provide a reference for subsequent quality control and quality inspection. Quality Planning and control At this stage, it is necessary to carry out quality planning and control of the whole process of product or service design, production and delivery.
Know whether the operation process is on siteWhether the drawings, instructions, and standards used are the latest version, whether the identification of the product status in the field division is clear, and whether the product traceability is clear. Supervise whether the quality target can reach the predetermined target, and organize relevant personnel to analyze and take corresponding measures if it is insufficient. Whether the company's various work plans have been achieved (including training), and whether there are corresponding records.
Each industry has its own characteristics, do not follow the book, such as process reengineering and 6 Sigma improvement organization, some companies are also included in the quality management system. There is usually no common standard, but reference can be made to industry markersPole (the top 5 companies in the peer group), set their own quality organization's process management.
Process self-identification 1 Through a week of learning, I feel that I have gained in the following aspects: a preliminary systematic understanding of the theory of electronic technology. We understand the skills of welding common components and circuit components, the design and production of printed circuit board diagram and the process flow, the working principle and the role of components.
Self-identification work aspect 1 time hurriedly turn away, now workIt has gradually become natural, which perhaps should be a kind of happiness, is an experience that makes me worthy of nostalgia. After more than a month's probation, I worked hard and made a lot of progress. I learned a lot of things that I did not have before. I think this is not only work, but more importantly, it gives me a chance to learn and exercise.
Engineering Self-identification 1 Before I was about to graduate, I made the following self-identification of myself: In mind, in the school of __ years of life, I am diligent and strong, insist on honesty. I study for work, to improve my professional skills. So studying at school, IBecome more confident.
Actively promote and apply "new science, new technology, new technology, new materials".